This isn't just an incremental improvement, it's a critical enabler for the explosive growth of AI-driven data centers.

Why This Matters for AI Scale-Up

• Powers Co-Packaged Optics (CPO): By integrating high-power optical amplification directly with silicon photonics, this SOA supports External Laser Small Form-Factor Pluggable (ELSFP) modules and high-density photonic engines—eliminating power-hungry DSPs, shortening electrical paths, and slashing overall system power consumption by up to 3.5x or more compared to legacy pluggables.

• Handles Massive Data Throughput: The O-band wavelength (around 1310 nm) excels in short-reach, high-speed interconnects essential for AI clusters, high-performance computing (HPC), and next-gen data center fabrics—enabling terabit-scale bandwidth with superior signal integrity and lower latency.

• Thermal Robustness for Real-World Deployment: Maintaining >20% PCE at elevated 50°C temperatures ensure reliability in densely packed, heat-intensive AI server racks, reducing cooling demands and operational costs at hyperscale.

• Unlocks Broader AI & Beyond Applications: From optical interconnects fueling AI training to advanced FMCW LiDAR in autonomous systems, this platform delivers the optical muscle needed to keep pace with exploding compute demands.

Built on SemiNex's proprietary epitaxial growth and advanced optical waveguide designs, the Ultra-High-Power SOA platform pushes output beyond 30 dBm—setting a new benchmark in performance. SemiNex's expert team stands ready to collaborate with partners on seamless integration into silicon photonic integrated circuits (Si PICs) for cutting-edge data center solutions.

For more details about the Ultra-High-Power SOA platform, please email marketing@seminex.com to discuss sampling opportunities and to schedule a technical collaboration.

SemiNex was founded in 2003 and is headquartered in the US.